Technology

It is not about number of ISO standards but about capability to meet client's expectations. On that ground we invest into the best available technologies for PCB manufacturing in the market.

Technologie

CAM software

Technologie

CNC

Technologie

Clean Room

Technologie

Wet processes

Technologie

Multilayer press

Technologie

Surface finishing

Technologie

Testing

Technologie

Neutralization

Wet processes

WISE - brushing

WISE - brushing

Within the PCB production a brushing line is used for removal of burr from holes and oxidation from copper surfaces. The line is equipped with an automatic brush pressure setting and high pressure rinsing.

MORE INFO

Plasonic - plasma

Plasonic - plasma

Plasma treatment removes resin from walls of drilled holes to allow perfect connection of galvanic copper on PCB internal layers. This method is convenient either for standard FR4 materials and for advanced materials with higher Tg, halogen free, polyimide (flex, rigid-flex), PFE etc. as well  

MORE INFO

Laif - direct plating

Laif - direct plating

The process of direct plating is based on graphite layer deposit on PCB dialectric surface which are to be plated through with galvanic copper. It is essential process verified by long-term operation.

MORE INFO

Matusewitz - chemical cleaning

Matusewitz - chemical cleaning

Matusewitz MECetch line - this process replaces the brushing process in some areas. It brings far greater copper roughness and therefore it´s bigger surface. This treatment is suitable for application with dry resist, solder mask even for finishes pre-treatment. This technology is used also for copper surface treatment for flexi PCBs thanks to its minimal mechanical stress. Modern line software enables flexible program setting and simultaneously controls the automatic dosing based on continuous copper measurement.

MORE INFO

Laif - resist developer

Laif - resist developer

After dry resist exposure future connections are developed. This means that not imaged areas of photo sensitive material are chemically removed in sodium carbonate solution.

MORE INFO

Schmid - solder mask developer

Schmid - solder mask developer

Not imaged surfaces of solder mask are removed by developing process. 

PPT Trenčianská Teplá - galvanic line

PPT Trenčianská Teplá - galvanic line

Galvanic line serves for plating-through of holes and copper thickening to required thickness and it represents core process of PCB production. The line contains acid copper and galvanic tin baths

MORE INFO

Pill - dry resist stripper

Pill - dry resist stripper

For removal of dry resist we use PILL equipment which features high rinsing function for complex boards processed by pattern plating method.

MORE INFO

Schmid - acid etching

Schmid - acid etching

Excess copper is removed from PCB by using copper dichloride solution. The system itself measures bath selected parameters and upon results adds necessary chemicals.

MORE INFO

Laif - alcalic etching

Laif - alcalic etching

Ammoniacal etchant removes excess copper from PCB. The process itself controls solution pH value and density.

MORE INFO

Schmid - copper pre-treatment

Schmid - copper pre-treatment

V-Bond is suitable for treatment of internal layers before pressing. Unique surface topography formed by V-Bond improves adhesion of resin to copper.

MORE INFO

Resco - tin stripper

Resco - tin stripper

Serves for removal of tin as protective resist before etching.