It is not about number of ISO standards but about capability to meet client's expectations. On that ground we invest into the best available technologies for PCB manufacturing in the market.
WISE - brushing
Within the PCB production a brushing line is used for removal of burr from holes and oxidation from copper surfaces. The line is equipped with an automatic brush pressure setting and high pressure rinsing.
Plasonic - plasma
Plasma treatment removes resin from walls of drilled holes to allow perfect connection of galvanic copper on PCB internal layers. This method is convenient either for standard FR4 materials and for advanced materials with higher Tg, halogen free, polyimide (flex, rigid-flex), PFE etc. as well
Laif - direct plating
The process of direct plating is based on graphite layer deposit on PCB dialectric surface which are to be plated through with galvanic copper. It is essential process verified by long-term operation.
Matusewitz - chemical cleaning
Matusewitz MECetch line - this process replaces the brushing process in some areas. It brings far greater copper roughness and therefore it´s bigger surface. This treatment is suitable for application with dry resist, solder mask even for finishes pre-treatment. This technology is used also for copper surface treatment for flexi PCBs thanks to its minimal mechanical stress. Modern line software enables flexible program setting and simultaneously controls the automatic dosing based on continuous copper measurement.
Laif - resist developer
After dry resist exposure future connections are developed. This means that not imaged areas of photo sensitive material are chemically removed in sodium carbonate solution.
Schmid - solder mask developer
Not imaged surfaces of solder mask are removed by developing process.
PPT Trenčianská Teplá - galvanic line
Galvanic line serves for plating-through of holes and copper thickening to required thickness and it represents core process of PCB production. The line contains acid copper and galvanic tin baths
Pill - dry resist stripper
For removal of dry resist we use PILL equipment which features high rinsing function for complex boards processed by pattern plating method.
Schmid - acid etching
Excess copper is removed from PCB by using copper dichloride solution. The system itself measures bath selected parameters and upon results adds necessary chemicals.
Laif - alcalic etching
Ammoniacal etchant removes excess copper from PCB. The process itself controls solution pH value and density.
Schmid - copper pre-treatment
V-Bond is suitable for treatment of internal layers before pressing. Unique surface topography formed by V-Bond improves adhesion of resin to copper.
Resco - tin stripper
Serves for removal of tin as protective resist before etching.