Technology

It is not about number of ISO standards but about capability to meet client's expectations. On that ground we invest into the best available technologies for PCB manufacturing in the market.

Technologie

CAM software

Technologie

CNC

Technologie

Clean Room

Technologie

Wet processes

Technologie

Multilayer press

Technologie

Surface finishing

Technologie

Testing

Technologie

Neutralization

Surface finishing

Penta - HAL lead free

Penta - HAL lead free

HAL (hot air levelling) is at present still one of the most required finish. This led us to a decision of purchasing new HAL device from Penta Company, which meets the most complex requirements for lead free solder coating on PCB. Mentioned process can be modified with supplements like double submerge, flap vibration or economical temperature management.

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PPT - Immersion Silver

PPT - Immersion Silver

Immersion silver has best usage in HF applications. Because of missing Nickel is ideal for high frequency signals. Silver is better conductor than Au or Cu. It is easily solderable finish - IAg thickness is only 0,1 µm so even flatless is great. Because of this characteristics it is commonly used for high construction classes of the printed boards too. 

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Lantronic - HAL PbSn

Lantronic - HAL PbSn

Lantronic 204-S allows to apply diluted solder with lead onto copper surface. Solder composition is 63% Sn and 37% Pb.

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PPT Trenčianská Teplá - ENIG

PPT Trenčianská Teplá - ENIG

Gold is an ideal element for top PCB cover. Given that gold doesn´t form oxides, the temperature and storage conditions have nearly no effect on its durability or condition compared to other finishes. Excellent adhesion is result of practically instant dissolution of gold into the solder. Nickel layer needs to be coated between copper and gold layers to prevent their mixing and therefore causing problems with soldering. This finish is suitable for AI wire bonding.

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PPT Trenčianská Teplá - chemical tin

PPT Trenčianská Teplá - chemical tin

Chemical tin bath excludes thin and even layer of pure tin selectively on copper surface and in plated holes. Tin layer acquired by this process meets all modern final PCB´s finish requirements.

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PPT Trenčianská Teplá - galvanic Ni/Au

PPT Trenčianská Teplá - galvanic Ni/Au

During the process is applied cca 5-10 um of glavanic nickel and 1-3 um of galvanic gold. In this case we talk about so-called hard gold. Galvanic gold is mostly used for protection from direct contact of connectors.

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