It is not about number of ISO standards but about capability to meet client's expectations. On that ground we invest into the best available technologies for PCB manufacturing in the market.
Electric testers ATG A5 XL8 / A3*8 / A7 are top equipment for testing of not assembled PCB. Tester has 8 probes in total which perform parallel contacting and measurement of boards. Customer shall receive certificate that guarantees reliability of supplied goods with each delivery of tested printed circuit boards.
Orbotech - AOI
AOI automated optical inspection system based on comparison of CAM software output data and real PCB image. Camera system verifies in real time possible short-circuit, open-circuit on surface, further it is able to evaluate etching level which does not meet IPC standard parameters etc.
Oxford Instruments - X-ray analyzer
CMI 900 is designed for non-destructive measurement of the thickness of the surface layers. These analyzers are able to measure thickness of any surface, single/multi layers or alloys on almost any underlay. Device is also able determine concentration of solution, composition of alloys and perform analysis of materials.
Oxford Instruments - copper thickness measurement
CMI 700 is modular device for exact determination of the thickness of different layers of Cu both on surface and in holes. Device can be configured in any combination with three measuring modules: micro-resistance module MRX, Beta backscatter module and module based on principle of eddy currents and magnetic induction EMX.