Ventec launches new bonded dielectric material and value-added services
During IPC APEX Expo 2024 (California 6.-11. 4. 2024), Ventec International Group introduced new bonded dielectric material for advanced signal integrity and thermal performance. In this article, we will review these new materials.
A little about Ventec International Group
A Chinese company founded in 2000 with four manufacturing plants. Designs, develops and markets high quality copper clad laminates and prepreg fasteners for the manufacture of a wide range of printed circuit board (PCB) applications.
New bonded dielectric material from Ventec
State-of-the-art computers, multilayer boards with high layer counts, high-performance motherboards or perhaps power amplifiers for mobile networks need high-speed, low-loss signal integrity with reliable thermal management in ML PCB stackups. Ventec pro-bond and thermal-bond materials are designed for exactly these applications.
Ventec International Group is launching four types of new bonded dielectric material to provide you with an excellent combination of low dissipation factor (Df) and a range of dielectric constant (Dk) for the best possible PCB design.
These four types of pro-bond bonded dielectric material include resin-coated copper (RCC) and resin-coated foil (RCF) materials with b-stage dielectric. RCC bondply is a non-reinforced adhesive system deposited on ultra-thin copper foil (1.5–5.0 μm supported by an 18 μm carrier film). RCF bondply is a non-reinforced adhesive system deposited on PET film for use in high-performance and high-reliability multilayer printed circuit board assemblies.
What four types of pro-bond are available:
- Pro-bond 4C: low Dk / low Df Resin Coated Copper Bondply
- Pro-bond 7C & 7F: Ultra low Dk / Df Resin Coated Copper & Resin Coated Film Bondply
- Pro-bond 8C: Ultra low Dk / Df Resin Coated Copper Bondply
- Pro-bond 20F: Ultra low Dk / Df Resin Coated Film Bondply
Thermal-bond 3.0F and Thermal-bond 5.0F significantly advance the thermal conductivity level of substrates that are made of MIMS. The thermal conductivity for Thermal-bond 3.0F is 3.6 W/m.K and for the Thermal-bond 5.0F type is 7.0 W/m.K. This makes Thermal-bond suitable for applications such as LED lighting, mains-powered and battery-powered DC/DC converters, distributed energy harvesting systems, cloud-based artificial intelligence accelerators, and more.
New portfolio of services Ventec International
Following the merger of Ventec and Giga Solutions, Ventec Giga Solutions was created in 2023. This new division provides comprehensive workflow solutions for customers in the PCB and related industries, including bonded dielectric material solutions. Installation and commissioning of these solutions is possible globally.
This service is particularly suitable for PCB manufacturers, OEMs, and manufacturing service companies. Our experienced team can help you set up and expand your PCB manufacturing facility using Ventec Giga Solutions' expertise in bonded dielectric material technologies.
Now, in 2024, Ventec Giga Solutions is joining forces with Cardel Group. With this collaboration, Ventec Giga Solutions also covers the US market. Initially, Ventec Giga Solutions offered project management, factory design, equipment suitability consulting, sourcing, installation, commissioning, and delivery of customized equipment and solutions. In addition to these activities, Ventec Giga Solutions offers innovation in high-performance substrate materials, including bonded dielectric material solutions.